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Stencil (template) chip size PS3-CPU for reballing (reball) Sony PlayStation 3 (PS3) BGA IC chips with direct heating
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BGA Reballing Schablone Für PS5/PS4/XBOX360/SCHALTER/NS Master-Chip IC South bridge GPU CXD2999BGG/CXD90044GB/CXD90037G/CXD90055GB _ - AliExpress Mobile
PS4 APU Reballing | Playstation 4 reballing procedure means we replace all solder joints between SoC (System on Chip) and printed circuit board. New fresh solder spheres... | By TFix | Facebook
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90*90mm PS4 BGA Reballing Schablonen Spiel Konsole IC Reball Station Solder Ball Stahl Vorlage CXD90025G CXD90026G 6PCS 4PCS|Flussmittel| - AliExpress
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Reparacion de Notebooks Laptop Baires - Laboratorio con servicio profesional de Reballing BGA Rework
![Stencil (template) chip size PS4 CXD90026G for reballing (reball) PlayStation 4 (PS4) BGA IC chips with direct heating Stencil (template) chip size PS4 CXD90026G for reballing (reball) PlayStation 4 (PS4) BGA IC chips with direct heating](https://parts4laptops.eu/8015/stencil-chip-size-ps4-cxd90026g-for-reballing-playstation-4-bga-ic-chips.jpg)
Stencil (template) chip size PS4 CXD90026G for reballing (reball) PlayStation 4 (PS4) BGA IC chips with direct heating
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